Specifications - NVIDIA Docs

NVIDIA Docs Hub NVIDIA IGX Orin NVIDIA IGX Orin Developer Kit Product Brief Specifications

The following table lists the specifications for the NVIDIA IGX Orin Developer Kit.

Component	Function	Comment
Ordering Information
NVIDIA IGX Orin Developer Kit	940-23840-0000-000 940-23840-0001-000 940-23840-0002-000	Cordless NA/TW/CN/JP EU/UK
Key Components
NVIDIA IGX Orin module	NVIDIA Orin™ SoC: NVIDIA Ampere architecture GPU (2x GPC \| 8x TPC \| 2048 NVIDIA® CUDA® core \| 64 Tensor Cores / 1,185.75 MHz) Arm® Cortex-A78AE CPU (12x Cores \| 3x CPU Clusters \| 64KB L1 I-cache + 64 KB L1 D-cache \| 256 KB L2 per CPU core \| 2 MB per CPU cluster \| 1,996 MHz) DL accelerator (2x NVDLA 2.0 Engines \| 1,408 MHz) Performance: INT8 TOPS – up to 248 SPECint_rate2006 – up to 233 LPDDR5: 64 GB \| 256-bit \| 3,200 MHz Storage: eMMC – 64 GB eMMC 5.1 (HS400) QSPI NOR Flash – 64 MB NOR Boot flash Security Key Storage – 8 MB NOR secure Key Flash	Projected
NVIDIA BMC module	Baseboard management controller (BMC): Aspeed AST2600
NVIDIA ConnectX-7	Networking and PCIe bridge: 2x 100GbE QSFP 2x PCIe Gen5
Safety MCU (SMCU)	Infineon Aurix TC397
dGPU card	NVIDIA RTX A6000	optional
Storage	SSD – 500 GB
Wireless	802.11 a/b/g/n/ac \| BT 5.0
Input and Output
PCIe	2x PCIe Gen5: x8 lanes within 16x physical connector x16 lanes within 16x physical connector	From ConnectX-7
Ethernet	2x RJ45 (up to 1 GbE) 2x QSFP28 (up to 100 GbE)	From BMC or Orin From ConnectX-7
DisplayPort	DisplayPort 1.4a output
HDMI-IN	HDMI 2.0b input (up to 4kp60)
USB	x1 USB 3.2 Gen2 Type-C connector x4 USB 3.2 Gen2 Type-A connectors
Audio (AU)	Line out Mic In
Sp ecifications
Power	100 ~ 240 VAC: 100 VAC: 12 A 240 VAC: 6 A	uATX Power supply: up to 850 W at DC
Temperature	Operating: 5°C ~ 35°C Board power off: 0°C ~ 60°C Storage: -40°C ~ 85°C
Relative Humidity	Operating: 8% ~ 95% Board power off: 5% ~ 95% Storage: 8% ~ 95%
Dimension (W × L × H)	262.70 × 382.70 × 151.20	mm
Weight	6,800 (Developer Kit only) 8,000 (Developer Kit with RTX A6000)	gram