Specifications
Power numbers are provided for passive cables only. For board power numbers while using active cables, please add the outcome of the following formula to the passive cables power numbers stated below:
Active_Module_Power x Number_of_Modules x 1.1 (efficiency factor)
These products have reached the end-of-life milestone.
Capabilities |
|
|||
Physical |
Size: 4.89in. x 2.71in (124.22mm x 68.90mm) |
|||
Connector: Dual SFP28 Ethernet (copper and optical) |
||||
Protocol Support |
Data Rate: |
Ethernet |
1/10/25 Gb/s |
|
Ethernet: 25GBASE-R, 20GBASE-KR2, 10GBASE-LR,10GBASE-ER, 10GBASE-CX4, 10GBASE-CR, 10GBASE-KR, SGMII, 1000BASE-CX, 1000BASE-KX, 10GBASE-SR |
||||
PCI Express Gen 3.0/4.0: SERDES @ 16.0GT/s, 8 lanes (2.0 and 1.1 compatible) |
||||
Power and Airflow Specifications(a) |
Voltage: 3.3Aux Maximum current: 100mA |
|||
Power |
Cable |
PCIe Gen 3.0 |
PCIe Gen 4.0 |
|
Typical Power |
Passive Cables |
10.88W |
11.29W |
|
Maximum Power |
Passive Cables |
15.55W |
15.96W |
|
Maximum power available through SFP28 port: 1.5W (per port) |
||||
Airflow @ 55Cb) |
Cable Type |
Hot Aisle - Heatsink to Port |
||
Passive Cable |
200LFM |
|||
Active 0.8W Cable |
400 LFM |
|||
Active 1.5W Cable |
450LFM |
|||
Environmental |
Temperature |
Operational |
0°C to 55°C |
|
Non-operational |
-40°C to 70°C(c) |
|||
Humidity |
Operational |
10% to 85% relative humidity |
||
Non-operational |
10% to 90% relative humidity |
|||
Altitude (Operational) |
3050m |
|||
Regulatory |
Safety |
CB / cTUVus / CE |
||
EMC |
CE / FCC / VCCI / ICES / RCM |
|||
RoHS |
RoHS compliant |
|||
a. Typical power for ATIS traffic load. b. Airflow is measured in wind tunnel. Contact NVIDIA for airflow numbers with other active modules' power levels. c. The non-operational storage temperature specifications apply to the product without its package. |
These products have reached the end-of-life milestone.
Capabilities |
|
|||
Physical |
Size: 5.59in. x 2.71in (142.00mm x 68.90mm) |
|||
Connector: Dual SFP28 Ethernet (copper and optical) |
||||
Protocol Support |
Data Rate: |
Ethernet |
1/10/25 Gb/s |
|
Ethernet: 25GBASE-R, 20GBASE-KR2, 10GBASE-LR,10GBASE-ER, 10GBASE-CX4, 10GBASE-CR, 10GBASE-KR, SGMII, 1000BASE-CX, 1000BASE-KX, 10GBASE-SR |
||||
PCI Express Gen 3.0/4.0: SERDES @ 16.0GT/s, 16 lanes (2.0 and 1.1 compatible) |
||||
Power and Airflow (a) |
Voltage: 3.3Aux Maximum current: 100mA |
|||
Power |
Cable Type |
PCIe Gen 3.0 |
PCIe Gen 4.0 |
|
Typical Power |
Passive Cables |
14.87W |
15.68W |
|
Maximum Power |
Passive Cables |
18.92W |
19.74W |
|
Maximum power available through SFP28 port: 2.5W (each port) |
||||
Airflow @ 55C(b) |
Cable Type |
Hot Aisle - Heatsink to Port |
||
Passive Cable |
300LFM |
|||
Active 0.8 Cable |
400LFM |
|||
Active 2.5W Cable |
500LFM |
|||
Environmental |
Temperature |
Operational |
0°C to 55°C |
|
Non-operational |
-40°C to 70°C(c) |
|||
Humidity |
Operational |
10% to 85% relative humidity |
||
Non-operational |
10% to 90% relative humidity |
|||
Altitude (Operational) |
3050m |
|||
Regulatory |
Safety |
CB / cTUVus / CE |
||
EMC |
CE / FCC / VCCI / ICES / RCM |
|||
RoHS |
RoHS compliant |
|||
a. Typical power for ATIS traffic load. b. Airflow is measured in wind tunnel. Contact NVIDIA for airflow numbers with other active modules' power levels. c. The non-operational storage temperature specifications apply to the product without its package. |
These cards are optimized for Workstation Environments and include an onboard cooling fan that meets the acoustic requirement for workstations.
At Idle 20 dBA max
TDP Room 34 dBA Max
TDP Max 47 dBA Max
Fan speed is controlled automatically depending on board load.
Capabilities |
|
|||
Physical |
Size: 6.01in. x 2.71in (152.9mmx 68.9 mm) |
|||
Connector: Dual SFP28 Ethernet (copper and optical) |
||||
Protocol Support |
Data Rate: |
Ethernet |
1/10/25 Gb/s |
|
Ethernet: 25GBASE-R, 20GBASE-KR2, 10GBASE-LR,10GBASE-ER, 10GBASE-CX4, 10GBASE-CR, 10GBASE-KR, SGMII, 1000BASE-CX, 1000BASE-KX, 10GBASE-SR |
||||
PCI Express Gen 3.0/4.0: SERDES @ 16.0GT/s, 8 lanes (2.0 and 1.1 compatible) |
||||
Capabilities |
MCX621202AS-ADAT: Crypto Disabled, Secure Boot Enabled MCX621202AC-ADAT: Crypto Enabled(a), Secure Boot Enabled |
|||
Power Specifications(a) |
Voltage: 3.3Aux Maximum current: 100mA |
|||
Power |
Cable Type |
PCIe Gen 3.0 |
PCIe Gen 4.0 |
|
Typical Power |
Passive Cables |
9.6W |
9.9W |
|
Maximum Power |
Passive Cables |
13.7W |
14W |
|
Maximum power available through SFP28 port: 2.5W (each port) |
||||
Maximum Allowed Inlet Temperature(b) |
External Airflow Conditions |
Cable Type |
Maximum Allowed Fan Inlet Temperature |
|
No External Airflow |
Passive Copper Module |
50° |
||
NVIDIA SFP28 0.8W Module |
40° |
|||
10G Base SFP-10G-T-NC 2.5W Cable |
40° |
|||
150LFM External Airflow (Airflow Direction: Heatsink to Port) |
Passive Copper Module |
55° |
||
NVIDIA SFP28 0.8W Module |
50° |
|||
10G Base SFP-10G-T-NC 2.5W Cable |
50° |
|||
Environmental |
Temperature |
Operational |
0°C to 55°C |
|
Non-operational |
-40°C to 70°C(c) |
|||
Humidity |
Operational |
10% to 85% relative humidity |
||
Non-operational |
10% to 90% relative humidity |
|||
Altitude (Operational) |
3050m |
|||
Regulatory |
Safety |
CB / cTUVus / CE |
||
EMC |
CE / FCC / VCCI / ICES / RCM |
|||
RoHS |
RoHS compliant |
|||
a. If your target application for this crypto-enabled card will utilize 100Gb/s or higher bandwidth, where a substantial part of the bandwidth will be allocated for IPsec traffic, please refer to the NVIDIA ConnectX-6 Dx Product Release Notes document to learn about a potential bandwidth limitation. See Related Documents section for details on accessing the document. b. Typical power for ATIS traffic load. c. Airflow is measured in wind tunnel. Contact NVIDIA for airflow numbers with other active modules' power levels. |
These products have reached the end-of-life milestone.
Capabilities |
|
|||
Physical |
Size: 5.59in. x 2.71in (142.00mm x 68.90mm) |
|||
Connector: Dual SFP56 Ethernet (copper and optical) |
||||
Protocol Support |
Data Rate: |
Ethernet |
1/10/25/40/50 Gb/s |
|
Ethernet: 50GBASE-R2, 50GBASE-R4, 40GBASE-CR4, 40GBASE-KR4, 40GBASE-SR4, 40GBASE-LR4, 40GBASE-ER4, 40GBASE-R2, 25GBASE-R, 20GBASE-KR2, 10GBASE-LR,10GBASE-ER, 10GBASE-CX4, 10GBASE-CR, 10GBASE-KR, SGMII, 1000BASE-CX, 1000BASE-KX, 10GBASE-SR |
||||
PCI Express Gen 3.0/4.0: SERDES @ 16.0GT/s, 16 lanes (2.0 and 1.1 compatible) |
||||
Power and Airflow (a) |
Voltage: 3.3Aux Maximum current: 100mA |
|||
Power |
Cable Type |
PCIe Gen 3.0 |
PCIe Gen 4.0 |
|
Typical Power |
Passive Cables |
14.94W |
15.76W |
|
Maximum Power |
Passive Cables |
20.16W |
20.98W |
|
Maximum power available through SFP56 port: 2.5W (each port) |
||||
Airflow Requirements @ 55C(b) |
Cable Type |
Hot Aisle - Heatsink to Port |
||
Passive Cable |
300LFM |
|||
Active 0.8 Cable |
400LFM |
|||
Environmental |
Temperature |
Operational |
0°C to 55°C |
|
Non-operational |
-40°C to 70°C |
|||
Humidity |
Operational |
10% to 85% relative humidity |
||
Non-operational |
10% to 90% relative humidity(c) |
|||
Altitude (Operational) |
3050m |
|||
Regulatory |
Safety |
CB / cTUVus / CE |
||
EMC |
CE / FCC / VCCI / ICES / RCM |
|||
RoHS |
RoHS compliant |
|||
a. Typical power for ATIS traffic load. b. Airflow is measured in wind tunnel. Contact NVIDIA for airflow numbers with other active modules' power levels. c. The non-operational storage temperature specifications apply to the product without its package. |
MCX623105AE-CDAT and MCX623105AN-CDAT have reached the end-of-life milestone.
Capabilities |
| |||
Physical | Size: 5.59in. x 2.71in (142.00mm x 68.90mm) | |||
Connector: Single QSFP56 Ethernet (copper and optical) | ||||
Protocol Support | Data Rate: | Ethernet | 1/10/25/40/50/100 Gb/s | |
Ethernet: 100GBASE-CR2, 100GBASE-CR4, 100GBASE-KR4, 100GBASE-SR4, 100GBASE-LR4, 50GBASE-R2, 50GBASE-R4, 40GBASE-CR4, 40GBASE-KR4, 40GBASE-SR4, 40GBASE-LR4, 40GBASE-ER4, 40GBASE-R2, 25GBASE-R, 20GBASE-KR2, 10GBASE-LR,10GBASE-ER, 10GBASE-CX4, 10GBASE-CR, 10GBASE-KR, SGMII, 1000BASE-CX, 1000BASE-KX, 10GBASE-SR, 100GBASE-CR2, 100GBASE-KR2, 100GBASE-SR2 | ||||
PCI Express Gen 3.0/4.0: SERDES @ 16.0GT/s, 16 lanes (2.0 and 1.1 compatible) | ||||
Power and Airflow (a) | Maximum current: 100mA | |||
Power | Cable Type | PCIe Gen 3.0 | PCIe Gen 4.0 | |
Typical Power | Passive Cables | 15.67W | 16.48W | |
Maximum Power | Passive Cables | 20.51W | 22W | |
Maximum power available through QSFP56 port: 5W (each port) | ||||
Altitude (Operational) | 3050m | |||
Airflow Requirements @ 55C(b) |
| Hot Aisle - Heatsink to Port | ||
Passive Cable | 500LFM | |||
Active 3.5W Cable | 600LFM | |||
| Temperature | Operational | 0°C to 55°C | |
Non-operational | -40°C to 70°C | |||
Humidity | Operational | 10% to 85% relative humidity | ||
Non-operational | 10% to 90% relative humidity(c) | |||
Altitude (Operational) | 3050m | |||
Regulatory | Safety | CB / cTUVus / CE | ||
EMC | CE / FCC / VCCI / ICES / RCM | |||
RoHS | RoHS compliant | |||
b. Airflow is measured in wind tunnel. Contact NVIDIA for airflow numbers with other active modules' power levels. c. The non-operational storage temperature specifications apply to the product without its package |
MCX623106AE-CDAT has reached the end-of-life milestone.
Capabilities |
| |||
Physical | Size: 5.59in. x 2.71in (142.00mm x 68.90mm) | |||
Connector: Dual QSFP56 Ethernet (copper and optical) | ||||
Protocol Support | Data Rate: | Ethernet | 1/10/25/40/50/100 Gb/s | |
Ethernet: 100GBASE-CR2, 100GBASE-CR4, 100GBASE-KR4, 100GBASE-SR4, 100GBASE-LR4, 50GBASE-R2, 50GBASE-R4, 40GBASE-CR4, 40GBASE-KR4, 40GBASE-SR4, 40GBASE-LR4, 40GBASE-ER4, 40GBASE-R2, 25GBASE-R, 20GBASE-KR2, 10GBASE-LR,10GBASE-ER, 10GBASE-CX4, 10GBASE-CR, 10GBASE-KR, SGMII, 1000BASE-CX, 1000BASE-KX, 10GBASE-SR, 100GBASE-CR2, 100GBASE-KR2, 100GBASE-SR2 | ||||
PCI Express Gen 3.0/4.0: SERDES @ 16.0GT/s, 16 lanes (2.0 and 1.1 compatible) | ||||
Power and Airflow (b) | Maximum current: 100mA | |||
Power | Cable Type | PCIe Gen 3.0 | PCIe Gen 4.0 | |
Typical Power | Passive Cables | 18.7W | 19.52W | |
Maximum Power | Passive Cables | 25.28W | 26.64W | |
Maximum power available through QSFP56 port: 5W (each port) | ||||
Airflow Requirements @ 55C(c) |
| Hot Aisle - Heatsink to Port | ||
Passive Cable | 550LFM | |||
Active 2.5W Cable | 700LFM | |||
Environmental | Temperature | Operational | 0°C to 55°C | |
Non-operational | -40°C to 70°C | |||
Humidity | Operational | 10% to 85% relative humidity | ||
Non-operational | 10% to 90% relative humidity(d) | |||
Altitude (Operational) | 3050m | |||
Regulatory | Safety | CB / cTUVus / CE | ||
EMC | CE / FCC / VCCI / ICES / RCM | |||
RoHS | RoHS compliant | |||
b. Typical power for ATIS traffic load. c. Airflow is measured in wind tunnel. Contact NVIDIA for airflow numbers with other active modules' power levels. d. The non-operational storage temperature specifications apply to the product without its package |
These products have reached the end-of-life milestone.
Capabilities |
| |||
Physical |
Size: 5.59in. x 2.71in (142.00mm x 68.90mm) | |||
Connector: Dual QSFP56 Ethernet (copper and optical) | ||||
Protocol Support |
Data Rate |
Ethernet |
1/10/25/40/50/100 Gb/s | |
Ethernet: 100GBASE-CR2, 100GBASE-CR4, 100GBASE-KR4, 100GBASE-SR4, 100GBASE-LR4, 50GBASE-R2, 50GBASE-R4, 40GBASE-CR4, 40GBASE-KR4, 40GBASE-SR4, 40GBASE-LR4, 40GBASE-ER4, 40GBASE-R2, 25GBASE-R, 20GBASE-KR2, 10GBASE-LR,10GBASE-ER, 10GBASE-CX4, 10GBASE-CR, 10GBASE-KR, SGMII, 1000BASE-CX, 1000BASE-KX, 10GBASE-SR, 100GBASE-CR2, 100GBASE-KR2, 100GBASE-SR2 | ||||
PCI Express Gen 3.0/4.0: SERDES @ 16.0GT/s, 16 lanes (2.0 and 1.1 compatible) | ||||
Power and Airflow (a) |
Maximum current: 100mA | |||
Power |
Cable Type |
PCIe Gen 3.0 |
Gen 4.0 | |
Typical Power |
Passive Cables |
TBD |
18.96W | |
Maximum Power |
Passive Cables |
TBD |
26.64W | |
Maximum power available through QSFP56 port: 5W (each port) | ||||
Airflow Requirements @ 55C(b) |
|
Hot Aisle - Heatsink to Port | ||
Passive Cable |
600LFM | |||
NVIDIA Active 2.5W Cable |
700LFM | |||
Environmental |
Temperature |
Operational |
0°C to 55°C | |
Non-operational |
-40°C to 70°C | |||
Humidity |
Operational |
10% to 85% relative humidity | ||
Non-operational |
10% to 90% relative humidity(c) | |||
Altitude (Operational) |
3050m | |||
Regulatory |
Safety |
CB / cTUVus / CE | ||
EMC |
CE / FCC / VCCI / ICES / RCM | |||
RoHS |
RoHS compliant | |||
b. Airflow is measured in wind tunnel. Contact NVIDIA for airflow numbers with other active modules' power levels. c. The non-operational storage temperature specifications apply to the product without its package |
MCX623106TN-CDAT and MCX623106GN-CDAT have reached the end-of-life milestone.
Capabilities |
| |||
Physical |
Size: 5.59in. x 2.71in (142.00mm x 68.90mm) | |||
Connector: Dual QSFP56 Ethernet (copper and optical) | ||||
Protocol Support |
Data Rate: |
Ethernet |
1/10/25/40/50/100 Gb/s | |
Ethernet: 100GBASE-CR2, 100GBASE-CR4, 100GBASE-KR4, 100GBASE-SR4, 100GBASE-LR4, 50GBASE-R2, 50GBASE-R4, 40GBASE-CR4, 40GBASE-KR4, 40GBASE-SR4, 40GBASE-LR4, 40GBASE-ER4, 40GBASE-R2, 25GBASE-R, 20GBASE-KR2, 10GBASE-LR,10GBASE-ER, 10GBASE-CX4, 10GBASE-CR, 10GBASE-KR, SGMII, 1000BASE-CX, 1000BASE-KX, 10GBASE-SR, 100GBASE-CR2, 100GBASE-KR2, 100GBASE-SR2 | ||||
PCI Express Gen 3.0/4.0: SERDES @ 16.0GT/s, 16 lanes (2.0 and 1.1 compatible) | ||||
Power and Airflow (b) |
Voltage: 12V | |||
Power |
Cable Type |
PCIe Gen 3.0 |
PCIe Gen 4.0 | |
Typical Power(b) |
Passive Cables |
TBD |
18.96W | |
Maximum Power |
Passive Cables |
TBD |
26.64W | |
Maximum power available through QSFP56 port: 5W (each port) | ||||
Maximum current: 100mA | ||||
Airflow Requirements @ 55C(c) |
|
Hot Aisle - Heatsink to Port | ||
Passive Cable |
550LFM | |||
Active 2.5W Cable |
700LFM | |||
Active 3.5W Cable |
1100LFM | |||
Environmental |
Temperature |
Operational |
0°C to 55°C | |
Non-operational |
-40°C to 70°C | |||
Humidity |
Operational |
10% to 85% relative humidity | ||
Non-operational |
10% to 90% relative humidity(d) | |||
Altitude (Operational) |
3050m |
| ||
Regulatory |
Safety |
CB / cTUVus / CE | ||
EMC |
CE / FCC / VCCI / ICES / RCM | |||
RoHS |
RoHS compliant | |||
b. Typical power for ATIS traffic load. c. Airflow is measured in wind tunnel. Contact NVIDIA for airflow numbers with other active modules' power levels. d. The non-operational storage temperature specifications apply to the product without its package |
MCX623105AS-VDAT and MCX623105AE-VDAT have reached the end-of-life milestone.
Capabilities |
| |||
Physical |
Size: 5.59in. x 2.71in (142.00mm x 68.90mm) | |||
Connector: Single QSFP56 Ethernet (copper and optical) | ||||
Protocol Support |
Data Rate: |
Ethernet |
1/10/25/40/50/100/200 Gb/s | |
Ethernet: 200GBASE-CR4, 200GBASE-KR4, 200GBASE-SR4, 100GBASE-CR2, 100GBASE-CR4, 100GBASE-KR4, 100GBASE-SR4, 100GBASE-LR4, 50GBASE-R2, 50GBASE-R4, 40GBASE-CR4, 40GBASE-KR4, 40GBASE-SR4, 40GBASE-LR4, 40GBASE-ER4, 40GBASE-R2, 25GBASE-R, 20GBASE-KR2, 10GBASE-LR,10GBASE-ER, 10GBASE-CX4, 10GBASE-CR, 10GBASE-KR, SGMII, 1000BASE-CX, 1000BASE-KX, 10GBASE-SR, 100GBASE-CR2, 100GBASE-KR2, 100GBASE-SR2 | ||||
PCI Express Gen 3.0/4.0: SERDES @ 16.0GT/s, 16 lanes (2.0 and 1.1 compatible) | ||||
Power and Airflow (b) |
Maximum current: 100mA | |||
Power |
Cable Type |
PCIe Gen 3.0 |
Gen 4.0 | |
Typical Power |
Passive Cables |
TBD |
16.94W | |
Maximum Power |
Passive Cables |
TBD |
24W | |
Maximum power available through QSFP56 port: 5W (each port) | ||||
Airflow Requirements @ 55C(c) |
|
Hot Aisle - Heatsink to Port | ||
Passive Cable |
600LFM | |||
Active 4.55W Cable |
950LFM | |||
Environmental |
Temperature |
Operational |
0°C to 55°C | |
Non-operational |
-40°C to 70°C | |||
Humidity |
Operational |
10% to 85% relative humidity | ||
Non-operational |
10% to 90% relative humidity(d) | |||
Altitude (Operational) |
3050m | |||
Regulatory |
Safety |
CB / cTUVus / CE | ||
EMC |
CE / FCC / VCCI / ICES / RCM | |||
RoHS |
RoHS compliant | |||
b. Typical power for ATIS traffic load. c. Airflow is measured in wind tunnel. Contact NVIDIA for airflow numbers with other active modules' power levels. d. The non-operational storage temperature specifications apply to the product without its package |
Board Mechanical Drawing and Dimensions
All dimensions are in millimeters. Mechanical tolerances are specified for each form factor.
Dual-Port SFP28/SFP56 x8 Adapter Cards Mechanical Drawing Mechanical Tolerance: Width: +/- 0.13mm Height: +0/-0.13mm |
Dual-Port SFP28 x8 Adapter Cards with Active Cooling Mechanical Drawing Mechanical Tolerance: Width: +/- 0.13mm Height: +0/-0.2mm |
Dual-Port SFP28/SFP56 x16 Adapter Cards Mechanical Drawing
Mechanical Tolerance: Width: +/- 0.13mm Height: +0/-0.13mm |
Single-Port QSFP56 x16 Adapter Cards Mechanical Drawing Mechanical Tolerance: Width: +/- 0.13mm Height: +0/-0.13mm |
Dual-Port QSFP56 x16 Adapter Cards Mechanical Drawing Mechanical Tolerance: Width: +/- 0.13mm Height: +0/-0.13mm |
Bracket Mechanical Drawing
All dimensions are in millimeters. All the mechanical tolerances are +/- 0.2mm.
Card Configuration |
Short Bracket |
Tall Bracket |
Dual-Port SFP28/SFP56 Cards |
|
|
Single-Port QSFP56 Cards |
|
|
Dual-Port QSFP56 Cards |
|
|