Specifications

The following table lists the specifications for the NVIDIA IGX Orin Developer Kit.

Component	Function	Comment
Ordering Information
NVIDIA IGX Orin Developer Kit	940-23840-0000-000 940-23840-0001-000 940-23840-0002-000	Cordless NA/TW/CN/JP EU/UK
Key Components
NVIDIA IGX Orin module	NVIDIA Orin™ SoC: NVIDIA Ampere architecture GPU (2x GPC \| 8x TPC \| 2048 NVIDIA® CUDA® core \| 64 Tensor Cores / 1,185.75 MHz) Arm® Cortex-A78AE CPU (12x Cores \| 3x CPU Clusters \| 64KB L1 I-cache + 64 KB L1 D-cache \| 256 KB L2 per CPU core \| 2 MB per CPU cluster \| 1,996 MHz) DL accelerator (2x NVDLA 2.0 Engines \| 1,408 MHz) Performance: INT8 TOPS – up to 248 SPECint_rate2006 – up to 233 LPDDR5: 64 GB \| 256-bit \| 3,200 MHz Storage: eMMC – 64 GB eMMC 5.1 (HS400) QSPI NOR Flash – 64 MB NOR Boot flash Security Key Storage – 8 MB NOR secure Key Flash	Projected
NVIDIA BMC module	Baseboard management controller (BMC): Aspeed AST2600
NVIDIA ConnectX-7	Networking and PCIe bridge: 2x 100GbE QSFP 2x PCIe Gen5
Safety MCU (SMCU)	Infineon Aurix TC397
dGPU card	NVIDIA RTX A6000	optional
Storage	SSD – 500 GB
Wireless	802.11 a/b/g/n/ac \| BT 5.0
Input and Output
PCIe	2x PCIe Gen5: x8 lanes within 16x physical connector x16 lanes within 16x physical connector	From ConnectX-7
Ethernet	2x RJ45 (up to 1 GbE) 2x QSFP28 (up to 100 GbE)	From BMC or Orin From ConnectX-7
DisplayPort	DisplayPort 1.4a output
HDMI-IN	HDMI 2.0b input (up to 4kp60)
USB	x1 USB 3.2 Gen2 Type-C connector x4 USB 3.2 Gen2 Type-A connectors
Audio (AU)	Line out Mic In
Sp ecifications
Power	100 ~ 240 VAC: 100 VAC: 12 A 240 VAC: 6 A	uATX Power supply: up to 850 W at DC
Temperature	Operating: 5°C ~ 35°C Board power off: 0°C ~ 60°C Storage: -40°C ~ 85°C
Relative Humidity	Operating: 8% ~ 95% Board power off: 5% ~ 95% Storage: 8% ~ 95%
Dimension (W × L × H)	262.70 × 382.70 × 151.20	mm
Weight	6,800 (Developer Kit only) 8,000 (Developer Kit with RTX A6000)	gram