IGX Orin Product Specifications (Latest Version)

Introduction

NVIDIA IGX Orin™ Boards Kit is an artificial intelligence (AI) platform built to power Healthcare applications and industrial automation. Operational technology (OT) providers are transforming legacy architectures into self-driving factories. NVIDIA IGX Orin Boards Kit is a new category of industrial edge computing for applying AI, security, and functional safety to enable self-driving factories. NVIDIA IGX Orin Boards Kit is architected to be cloud native, secure, and to deliver functional safety with enterprise support.

This product specification details the architectural specifications for the NVIDIA IGX Orin Boards Kit. This is a modular design with multiple modules plugged in to the connectors of a motherboard. The motherboard is a standard micro ATX form factor. An NVIDIA IGX Orin Industrial Module provides the processing and AI performance. An NVIDIA BMC Module provides board management of the system. In addition, PCIe slots are available along with standard I/O.

The following modules provided in the NVIDIA IGX Orin Boards Kit.

  • NVIDIA Board Management Controller (BMC) Module: for board management

  • NVIDIA IGX Orin Industrial Module: NVIDIA Orin processor module

Note
  • The NVIDIA IGX Orin Boards Kit, after this, is referred to as “IGX Orin Board.”

  • The NVIDIA IGX Orin Industrial Module, after this, is referred to as ‘IGX Module’.

  • The NVIDIA BMC Module, after this, is referred to as ‘BMC Module’

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Figure 1-1. NVIDIA IGX Orin Board Major Components

IGX Orin hardware can be logically divided into three buckets:

  • BMC Module

  • IGX Orin Board (Motherboard) including MCU and silicon-down NVIDIA® ConnectX®-7 IC

  • IGX Module: System on a Module (SOM)

IGX Orin Board is an open AI computing platform specifically designed for edge-based computing primarily targeted for industrial and medical device manufacturers as a white label product or directly into production environments. The system is designed around the IGX Module in a Micro ATX form factor. IGX Orin Board is an AI platform built to powerindustrial automation. Operational technology (OT) providers are transforming legacy architectures into self-driving factories. IGX Orin Board is a new category of industrial edge computing for applying AI, security, and functional safety to enable self-driving factories. IGX Orin Board is architected to be cloud native, secure, and to deliver functional safety with enterprise support.

The following table lists the features of the IGX Orin Board.

Features per Configuration

Feature

IGX Orin Board

NVIDIA SoC NVIDIA Orin SoC
CPU SPECint_rate2006 233 (Projected performance)
AI Performance - INT8 Sparse TOPs 248
System RAM 64 GB LPDDR5 (3,200 MHz)
QSPI NOR Flash 64 MB NOR Boot Flash
eMMC 64 GB eMMC 5.1 (HS400)
Security Key Storage 8 MB NOR Secure Key Flash (sNOR)
MCU Infineon Aurix TC397
BMC module Aspeed AST2600 Microchip ERoT
PCIe 1x PCIe Gen5 double width slot (x16) 1x PCIe Gen5 single width slot (x8)
Ethernet 2x 100 GbE QSFP28 ports 2x 1 GbE RJ45
USB 3.2 & USB 2.0 4x USB3.2 Gen2 Type A 4x USB 3.2 Gen2 (via headers) 1x USB 3.2 Gen2 Type C
DisplayPort One DisplayPort 1.4a output
Audio Input/Output 3x 3.5 mm AU jacks (MIC, line-in, speaker out)
Miscellaneous
Camera input Onboard camera input slot for future expansion
GPIO TBD
Wireless connection M.2 Key E (Wi-Fi and BT)
UART TBD
System power
IGX Module ConnectX-7 BMC Motherboard Up to 75W Up to 32W TBD TBD

Refer to the following documents or models listed for more information. Always use the latest revision of all documents.

  • NVIDIA IGX Orin Boards Kit Thermal Design Application Note

  • NVIDIA IGX Orin Industrial Module Data Sheet

  • NVIDIA IGX in Safety-Related Systems Application Note

  • NVIDIA IGX Boards Kit Mechanical Design and Installation Guidelines (DI-11306-001)

This product specification describes the detailed hardware architectural specifications of the developer system.

Terms and Definitions

Term

Definition

3LSS Three Layered Safety Supervision Framework
AI Artificial Intelligence
(AON) SPE (Always-On) Sensor Processing Engine
ATX Advanced Technology eXtended
BIST Built in Self-Test
BMC Board Management Computer
BT BlueTooth
CAN Controller Area Network
CCPLEX CPU Complex
COM Communication Port
CSI Camera Serial Interface
DC Diagnostic Coverage
DLA Deep Learning Accelerator
DP VESA® DisplayPort™
E/E/PE Electrical/Electronic/Programmable Electronic
EC Error Collator
ECC Error-Correcting Code
eMMC Embedded MMC
ENET Ethernet
EROT Extended Enhanced Root of Trust
EUC Equipment Under Control
FSI Functional Safety Island
GbE Gigabit Ethernet
GPIO General Purpose Input Output
HDMI™ High-Definition Multimedia Interface
HSM Hardware Safety Manager
IGX Industrial-Grade Edge AI platform
IST In System Test
JSEP Jetson Safety Extension Package
JTAG Joint Test Action Group interface
L4T Linux for Tegra
LPT Line Printer
LTE Long-Term Evolution wireless data communications technology
MIC Microphone
MCU Microcontroller Unit
NOR NOR-based memory
NVMe Non-Volatile Memory Express
PCB Printed Circuit Board
PCIe Peripheral Component Interconnect Express interface
QSFP Quad Small Form-factor Pluggable
RTC Real-Time-Clock
RTOS Real Time Operating System
SATA Serial AT Attachment
SCE Safety Cluster Engine
SDL Software Diagnostic Library
SEH System Error Handler
SIM Subscriber Identity Module card
SPI Serial Peripheral Interface
SoC System on a Chip
SOM System on a Module
SRP/CS Safety-related parts of control systems
SSD Solid-State- Drive
TE/OTE Test Equipment / Operational Test Equipment
TMON/VMON Thermal monitoring, Voltage monitoring
TPM Trusted Platform Module
UART Universal Asynchronous Receiver-Transmitter
USB Universal Serial Bus
Wi-Fi Wireless Fidelity
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