Document Revision History

May. 2023

Added non-operational storage temperature specifications.

Jan. 2023

Updated dimensions in board mechanical drawing

Nov. 2022

Updated board label example.

Sep. 2022

Added a note concerning FRU EEPROM memory component under the Features and Benefits table.

Jun. 2022

Added brackets mechanical drawings and dimensions.

Jan. 2021

• Updated MCX566A-CCAI and MCX566A-CDAB / MCX566A-CDAI in specifications.

• Updated LED Interface

Oct. 2020

• Updated airflow numbers in specifications.

• Updated networking ports LEDs indications

Sep. 2020

Added OCP 3.0 bracket replacement instructions.

Jul. 2020

Updated power numbers in "Specifications" and added missing airflow numbers.

May. 2020

Updated board labels.

Apr. 2020

Updated "Specifications"

Feb. 2020

Added altitude criteria to "Specifications".

Nov. 2019

Added a note to "Introduction".

Oct. 2019

Added MCX565M-CDAB to relevant sections of the document.

Updated Ethernet protocols support in "Specification".

Oct. 2019

Added a note to "Introduction".

Aug. 2019

• Added a note to "Introduction".

• Updated specifications tables.

• Updated board labels.

Jul. 2019

Added the following OPNs throughout the document:

• MCX565M-CDAI

• MCX562A-ACAB

• MCX566A-CCAI

• MCX566A-CDAB

Jun. 2019

Updated airflow numbers in Specifications

Apr. 2019

• Migrated to on-line format; minor reorganization.

• Updated power numbers in Specifications and added airflow numbers.

Nov. 2018

First release