Document Revision History
Date |
Description of Changes |
May. 2023 |
Added non-operational storage temperature specifications. |
Jan. 2023 |
Updated dimensions in board mechanical drawing |
Nov. 2022 |
Updated board label example. |
Sep. 2022 |
Added a note concerning FRU EEPROM memory component under the Features and Benefits table. |
Jun. 2022 |
Added brackets mechanical drawings and dimensions. |
Jan. 2021 |
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Oct. 2020 |
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Sep. 2020 |
Added OCP 3.0 bracket replacement instructions. |
Jul. 2020 |
Updated power numbers in "Specifications" and added missing airflow numbers. |
May. 2020 |
Updated board labels. |
Apr. 2020 |
Updated "Specifications" |
Feb. 2020 |
Added altitude criteria to "Specifications". |
Nov. 2019 |
Added a note to "Introduction". |
Oct. 2019 |
Added MCX565M-CDAB to relevant sections of the document. Updated Ethernet protocols support in "Specification". |
Oct. 2019 |
Added a note to "Introduction". |
Aug. 2019 |
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Jul. 2019 |
Added the following OPNs throughout the document:
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Jun. 2019 |
Updated airflow numbers in Specifications |
Apr. 2019 |
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Nov. 2018 |
First release |