Absolute Maximum Specifications
Absolute maximum ratings are those beyond which damage to the device may occur.
Between the operational specifications and absolute maximum ratings, prolonged operation is not intended and permanent device degradation may occur.
Data Input Voltage
Control Input Voltage
This table shows the environmental specifications for the product.
This section shows the range of values for normal operation.
Supply Voltage (Vcc)
Operating Case Temperature
Operating Relative Humidity
|Time propagation delay||--||--||4.5||ns/m||Informative|
OSFP Memory Map
|Page 00 Addr.||Register Name||Value and Description|
|SFF8024 Identifier||19h: OSFP form factor 8x pluggable transceiver|
|CMIS Revision Compliance||50h: CMIS Rev 5.0|
|Memory Model, MciMaxSpeed||80h: Flat memory (no paging), no CLEI, max 400 kHz TWI (I2C) frequency|
|Global status||07h: Module Ready, Interrupt not asserted|
04 - 84
|Lanes and flags||00h: No lane flags, no DDM flags|
|Media Type||03h: Passive Copper|
86 - 117
|Application Descriptors (8 x 4 bytes) numbered 1...8|
Host/Media Lane cnt
Host Lane Assignment
86 - 89
|31h: InfiniBand NDR, 2 ports||01h: Copper Cable||22h: 4 host + 4 media||55h: Lane 1 and 5|
90 - 93
|2Ch: IB SDR (4x two ports)||01h||22h||55h|
94 - 97
|1Bh: Eth 800GBASE-CR8 (8x one port)||01h||22h||55h|
98 - 101
|18h: Eth 400GBASE-CR4 (4x two ports)||01h||11h||FFh|
|45h: 200GBASE-CR2 (four ports)||01h||22h||55h|
106 - 109
|16h: 100GBASE-CR1 (eight ports)||01h||11h||FFh|
|01h: 400GBASE-CR8 (one port)||01h||11h||FFh|
114 - 117
|FFh: 200GBASE-CR4 (two ports)||00h||00h||00h|
118 - 121
|Password Chg Entry|
122 - 125
|Bank Select Byte|
|Page Select Byte|
|SFF8024 Identifier||19h: OSFP form factor 8x pluggable transceiver (same as addr 00)|
129 - 144
|VendorName||Vendor name (ASCII), padded w spaces: 'NVIDIA '|
|VendorOUI||Nvidia OUI: 48h, B0h, 2Dh|
148 - 163
|VendorPN||Part number: 'MCP7Y70-HXXX'|
164 - 165
166 - 181
182 - 189
|DateCode||Date code, (YYMMDD__)|
|Power Class||00h: Power Class 1, 07h: max power in units of 0.25 W|
|Max power consumption||01(in multiplier x 0.25W)|
|Link Length||Cable Length (m), 7-6: multiplier x value in bits 5-0 (00 = multiplier of .1 \ 01 = multiplier of 1\10 = multiplier of 10 \11 = multiplier of 100), e.g. 41h: 1 m|
|Connector Type||Connector Type (SFF-8024) 23h: No separable connector|
204 - 207
|Attenuation||Cable attenuation at 5, 7, 12.9, 25.8 GHz|
|Media Lane Info||00h: all near end lanes are implemented|
|Far End Config.||0Ch: 4x applications with 8x lanes each (aa,cc,ee,gg)|
|Media IF Technology||0Ah: Copper cable, unequalized|
|PageChecksum||Checksum of bytes 128-221 (low order 8 bits)|
223 - 255
|Custom Info||Custom data including traceability info|
QSFP56 Memory Map
|Page 00h||Register Name||Description|
11h: QSFP+ or later with SFF-8636 or SFF-8436 management interface
08h: Support for SFF-8436 Rev. 2.8 and 2.9
Far End and Near End Implementations
1Ch: far ends with 4 lanes implemented in each; Lanes 0-1 implemented on near end.
11h: QSFP+ or later with SFF-8636 or SFF-8436 management interface
00h: Not supported
23h: No separable connector (cable assembly with no separable interfaces)
Code for Serial Encoding Algorithm
Length in units of 1m
A0h: Copper cable unequalized
Extended Module Codes for IB
3Fh: Supports HDR/FDR/EDR/QDR/DDR/SDR
QSFP vendor IEEE number
00-02-C9: Mellanox OUI. (different from OSFP)
Part number per backshell label (ASCII)
ZZ: Revision per backshell label (ASCII)
@2.5G @5.0G @7.0G @12.9G
Max case temperature
46h: Support for 70ºC
40h: 200GBase CR
MTYYWWTTZZZZZ: Serial number per backshell label (ASCII).
YYMMDD: Year YY, month MM, day DD.
6Ah: Nominal baud rate per channel, units of 250 MBd.
Floating part of length in units of 10cm (example: 1.5m = 0x1 in byte146 + 0x05 in byte 236)
Wire thickness information.
30AWG: 7.2 ±0.0326AWG: 8.9 ±0.03
|Length tolerance||length < 2 m||±25||mm|
|length ≥ 2 m||±50|
Minimum Bend Radius
|OPN||Length (m)||Cable Diameter||Min bend radius R (mm)||Assembly Space L** (mm)|
The minimum assembly bending radius (close to the connector) is 10x the cable’s outer diameter. The repeated bend (far from the connector) is also 10x the cable’s outer diameter. The single bend (far from the connector) is 5x the cable’s outer diameter.
**Combined end’ is the ‘head’ where the cables join together, inserted into the switch. ‘Single end’ is the ‘tail’ which plugs into the HCA/NIC in a server.
L = Assembly Space. Minimum value depends on the backshell (connector housing) dimensions = the space for the cable assembly behind the rack door.
Assembly Bending Radius
OSFP Finned Head Dimensions
QSFP End Dimensions
Cable Length Definition (specified in Ordering Information section)
Cable Splitting Point
The following label is applied on the cable’s backshell. Note that the images are for illustration purposes only. Labels look and placement may vary.
Images are for illustration purposes only. Product labels, colors, and form may vary.
Backshell Label Legend
|PN – Part Number|
|yy||Cable gauge||American wire gauge|
|SN – Serial Number|
2 characters MT
Year of manufacturing
Week of manufacturing
5 digits for serial number. Reset at start of week to 00001.
|ZZ||HW and SW revision||2 alpha-numeric characters|
|XXAWG||Cable gauge||American wire gauge|
|YYYY-MM-DD||Year-month-day||Year 4 digits, month 2 digits, day 2 digits|
|COO||Country of origin||E.g., China|
|Quick response code||Serial number|
Cable Jacket Label (Middle of Cable)
The following label is applied on the cable’s jacket at each end. Note that the images are for illustration purposes only. Labels look and placement may vary.
The serial number and barcode are for NVIDIA internal use only. Images are for illustration purposes only. Product labels, colors, and form may vary.
Regulatory Compliance and Classification
Safety: CB, TUV, CE, EAC, UKCA
EMC: CE, FCC, ICES, RCM, VCCI
Ask your NVIDIA FAE for a zip file of the certifications for this product.
FCC Class A Notice
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.
Handling Precautions and Electrostatic Discharge (ESD)
The cable is compatible with ESD levels in typical data center operating environments and certified in accordance with the standards listed in the Regulatory Compliance Section. The product is shipped with protective caps on its connectors to protect it until the time of installation. In normal handling and operation of high-speed cables and optical transceivers, ESD is of concern during insertion into the QSFP cage of the server/switch. Hence, standard ESD handling precautions must be observed. These include use of grounded wrist/shoe straps and ESD floor wherever a cable/transceiver is extracted/inserted. Electrostatic discharges to the exterior of the host equipment chassis after installation are subject to system level ESD requirements.
Cable Management Guidelines
It is important to follow the instructions and information detailed NVIDIA Cable Management Guidelines and FAQ Application Note to insure proper and optimal installation of this cable and avoid physical damage.